Clear how to measuring reflow and wave profile.
清楚怎样测量回流焊和波峰焊温度曲线。
This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.
以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。
Which lead-free wave soldering , lead-free reflow after several years of research and development, has now reached international advanced level.
其中无铅波峰焊、无铅回流焊经过几年研究开发，目前已达到国际先进水平。
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