• 翘曲变形 - 引用次数：52

  The results showed that the warpage was mainly caused by GF orientation; the disortion degree could be decreased effectively by increasing part thickness or mould gates.

  结果表明,GF的取向是影响PA66/GF注射成型制品翘曲变形的主要原因;增加制品厚度或增设浇口均可有效减小制品的翘曲变形。

  参考来源 - 玻璃纤维增强PA66制品翘曲变形的研究
• 热变形 - 引用次数：10

  And the warpage of PBGA package is studied. The results show that temperature and thermal stress distribution are consistent with the experimental result.

  考虑了PBGA封装体的封装热变形，数值分析结果显示温度与热应力的分布与文献中的实验结果一致。

  参考来源 - 集成电路芯片封装的热—结构数值模拟分析及优化设计
• 卷曲
• 形状变形
  翘曲变形
  形状畸变
  扭曲量
• 翘曲

·2,447,543篇论文数据，部分数据来源于NoteExpress