A warpage analysis provides answers to questions such as: will the moulding distort?
变形分析可以对我们的难题进行解决，如：这个产品是否存在扭曲变形？
Base on the nonlinear large analysis, warpage of matrix SDBGA during the whole assembly processes are predicted.
文中基于非线性特性分析、预测了在整个集成工艺中SDBGA阵列的翘曲。
Semiconductor analysis with ANSYS tools often incorporates nonlinear behaviors, including package warpage, solder joint creep, fracture in through-silicon-via designs, fatigue and delimitation.
利用ANSYS工具，可以分析半导体的非线性特性，其中包括封装变形、焊接点蠕变以及过孔设计中的断裂、疲劳和层间开裂。
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