Fabrication of solar silicon wafer consists of wafer slicing and texturing of its surface.
太阳能硅片的制造工艺主要包括硅片的切割以及绒面制备两部分。
A solar wafer slicing method was studied, which was based on complex dielectric fluid and efficiency electric discharge machining (EDM) and electric chemical machining (ECM) technique.
提出了一种基于复合工作液的、以电火花电解复合加工技术对太阳能硅片进行切割的工艺方法。
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