Fabrication of solar silicon wafer consists of wafer slicing and texturing of its surface.
太阳能硅片的制造工艺主要包括硅片的切割以及绒面制备两部分。
A solar wafer slicing method was studied, which was based on complex dielectric fluid and efficiency electric discharge machining (EDM) and electric chemical machining (ECM) technique.
提出了一种基于复合工作液的、以电火花电解复合加工技术对太阳能硅片进行切割的工艺方法。
The slicing method of the invention is capable of implementing high area utilization efficiency of the photovoltaic wafer.
本发明的切片方法，可以实现更高的光伏晶片的面积利用效率。
应用推荐