Wafer pairs with bonding interface being native oxide or thermal oxide have different bonding behavior in the annealing process, which were investigated and compared.
将硅本征氧化层与硅热氧化层两种键合界面在退火过程中的行为进行了理论分析与比较。
The flags of PMAC is used as the general I/O interface and the pneumatic control loop of the wafer robot is designed.
并将PMAC的标志控制口改作为通用I/O口，在此基础上进行了硅片传输机器人的气动控制回路的设计。
Custom fixtures adapt the devices, which can be wafer, packaged parts, or connectorized modules, to the RI universal interface.
定制的装置与设备配合，它可以是薄片，封装零件，或连接器的模块，都能安装到RI接头上。
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