...方给出的是宽度从4μm~70nm按比例画出的线条。由此,我们对特征尺寸的按比例缩小有一个直观的印象。 3.晶片直径(Wafer Diameter)为了提高集成度,可适当增大芯片面积。然而,芯片面积的增大导致每个圆片内包含的芯片数减少,从而使生产效率降低,成本高。
基于36个网页-相关网页
... Source) i-line mercury lamp 套刻精度(Overlay) 0.6um or better 焦深(Depth of Focus) 8um@2um L/S 基板尺寸(Wafer Diameter) 730mm × 920mm 掩模尺寸(Reticle Size) 6 inch ..
基于16个网页-相关网页
The company said that three - and four-inch material accounted for 70 percent of the GaAs wafer output in 2007 and the market for larger diameter material will continue through 2012.
公司还认为,2007年3英寸和4英寸的材料将占到砷化镓晶片产量的70%,大直径材料市场到2012年将不断增长。
With the application of larger diameter silicon wafer, high precision grinding is widely used for its manufacturing.
随着大直径硅片的应用,硅片的超精密磨削得到广泛的应用。
With the fast development of IC manufacturing technology, the diameter of the silicon wafer trends to be larger in order to increase the yields of chips and reduce the cost per bit.
随着集成电路(IC)制造技术的飞速发展,为了进一步增加IC芯片的产量和降低单元制造成本,硅片趋向大直径化。
应用推荐