Direct wafer makes individual wafers straight from molten silicon-no cutting required.

直接硅片技术能直接在熔融晶中制成单片晶圆，不需要切割。

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Cutting groove grids on wafer surface in a special size and shape depends upon the costumers needs.

按客户要求的规格和形状在硅片表面切割出具有一定深度的沟槽。

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To introduce a number of polysilicon, wafer supporting projects, such as high purity quartz powder projects, cutting fluid, silicon carbide, cutting line, band saw into the zone.

硅料、硅片生产重要配套项目：如高纯度石英粉产业化项目、切割液、碳化硅、切割线、带锯等。

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Anadigics commands impressive incremental operating margins partly because its cutting-edge six-inch wafer fab in Warren, N.

FORBES: Anadigics Powers Up