The relationship between grinding marks and the grinding parameters is analyzed. The cutting trajectories of grits on the wafer are predicted by computer simulation.
本文建立了硅片自旋转磨削的运动几何学模型,分析了磨削参数与磨削纹理的关系,并对磨粒磨削运动轨迹进行了计算机仿真和预测;
Computer chip: or chip; integrated circuit or small wafer of semiconductor material embedded with integrated circuitry, comprises the processing and memory units of the modern digital computer.
芯片:集成电路或嵌入集成电路的小而薄的半导体,包含现代数字计算机的处理和记忆装置。
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