The pattern metal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.

图案化金属层位于绝缘层上并填入于导通孔中，以作为本实用新型多芯片封装结构的内连线层。

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All major utility diversion works are to be completed by the end of November 2012.

BBC: Edinburgh Trams: Trams on track with 14% budget left