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In this work, copper underpotential deposition on gold is studied under realistic electrochemical conditions
本文研究了在实际电化学条件下铜在金表面的低电位沉积
Thin-layer electrochemical studies of the underpotential deposition(UPD) of Bi and Te on cold rolled silver substrate have been performed.
研究了冷压银衬底上铋和碲的欠电位沉积薄层电化学行为。
We report here on the influence of surface electrification, concentration effects, and anion co-adsorption on the stability of the copper underpotential deposition layer on the gold (100) surface.
本研究报道了界面带电、浓度效应、阴离子共吸附对铜在金（ 100 ）表面的欠电位沉积层的稳定性所造成的影响。
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