...最新覆晶封装（Flip Chip）市场及技术发展趋势报告，更新了覆晶封装市场的最新商业动态，其中包括TIM、底部填充胶（underfills）、基板（substrates）及覆晶封装焊接器（Flip-Chip bonders）之资讯；该报告更新了对该市场2010~2018年的预测数据、详细的技术发...
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The effects of the curing process of the underfill on the vertical crack stress on top of the die, maximum equivalent stress of the low-k layer and equivalent plastic stain of the solder joint were investigated by finite element software.
通过有限元软件研究了底充胶固化工艺对芯片上方垂直开裂应力、焊点等效塑性应变及低k层最大等效应力的影响。
参考来源 - 底充胶固化工艺对低k倒装焊器件可靠性的影响The early studies usually described the underfill materials as classical linear elasticity in order to get a better computational efficiency. But the underfill shows significant viscoelasticity actually.
不同的材料模型对有限元模拟的结果会产生直接的影响,以往的研究通常会将下填料的材料模型简化为经典线弹性模型,以提高计算效率,但这与下填料表现的粘弹性特征有明显的区别。
参考来源 - 微电子倒装芯片封装粘弹性断裂研究·2,447,543篇论文数据，部分数据来源于NoteExpress
In addition, he also has very extensive experience in the development of underfills and adhesives.
此外，他在底部填充胶和粘接剂方面有着丰富的经验。
In this study, the metal flow and underfills in the boss forming are investigated by experimental observations, and methods for preventing underfills generation are described.
本文对该轮毂成形试验中的金属流动和两种欠肉缺陷进行了观察和分析，提出了预防两种欠肉缺陷产生的方法。
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