underfill, 意为“底部填充”。 比较流行的底部填充的方式， 主要通过“非接触喷射式”点胶。
倒装芯片工艺包括上助焊剂(fluxing)、芯片贴装(die placement)、回流(reflow)、底部充胶(underfill)和固化(cure)。 上助焊剂(fluxing) 上助焊剂(fluxing)是倒装芯片工艺的第一步，其重要性经常被低估了。
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Underfill Crack 底部填充裂缝
underfill theory 充盈不足学说 ; 低充盈理论
Underfill adhesive 底部填充胶
underfill materials 底部填充料
Underfill dispensing 点胶式底部填充
Underfill Flow Rate 流动速度
molded underfill 模塑底部填充
curing process of the underfill 底充胶固化工艺
no-flow underfill 不流动胶
The effects of the curing process of the underfill on the vertical crack stress on top of the die, maximum equivalent stress of the low-k layer and equivalent plastic stain of the solder joint were investigated by finite element software.
通过有限元软件研究了底充胶固化工艺对芯片上方垂直开裂应力、焊点等效塑性应变及低k层最大等效应力的影响。
参考来源 - 底充胶固化工艺对低k倒装焊器件可靠性的影响The early studies usually described the underfill materials as classical linear elasticity in order to get a better computational efficiency. But the underfill shows significant viscoelasticity actually.
不同的材料模型对有限元模拟的结果会产生直接的影响,以往的研究通常会将下填料的材料模型简化为经典线弹性模型,以提高计算效率,但这与下填料表现的粘弹性特征有明显的区别。
参考来源 - 微电子倒装芯片封装粘弹性断裂研究·2,447,543篇论文数据，部分数据来源于NoteExpress
In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip...
文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。
The first underfill is filled between the first chip and the second chip in order to wrap the first bump.
以及第一底胶，填充在所述第一芯片与所述第二芯片之间，且包覆所述第一凸块；
Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
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