underfill, 意为“底部填充”。 比较流行的底部填充的方式， 主要通过“非接触喷射式”点胶。
倒装芯片工艺包括上助焊剂(fluxing)、芯片贴装(die placement)、回流(reflow)、底部充胶(underfill)和固化(cure)。 上助焊剂(fluxing) 上助焊剂(fluxing)是倒装芯片工艺的第一步，其重要性经常被低估了。
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Underfill Crack 底部填充裂缝
underfill theory 充盈不足学说 ; 低充盈理论
Underfill adhesive 底部填充胶
underfill materials 底部填充料
underfill system 欠量装粉法
Underfill dispensing 点胶式底部填充
underfill detail 装填不满
Underfill Flow Rate 流动速度
molded underfill 模塑底部填充
The effects of the curing process of the underfill on the vertical crack stress on top of the die, maximum equivalent stress of the low-k layer and equivalent plastic stain of the solder joint were investigated by finite element software.
通过有限元软件研究了底充胶固化工艺对芯片上方垂直开裂应力、焊点等效塑性应变及低k层最大等效应力的影响。
参考来源 - 底充胶固化工艺对低k倒装焊器件可靠性的影响The early studies usually described the underfill materials as classical linear elasticity in order to get a better computational efficiency. But the underfill shows significant viscoelasticity actually.
不同的材料模型对有限元模拟的结果会产生直接的影响,以往的研究通常会将下填料的材料模型简化为经典线弹性模型,以提高计算效率,但这与下填料表现的粘弹性特征有明显的区别。
参考来源 - 微电子倒装芯片封装粘弹性断裂研究·2,447,543篇论文数据，部分数据来源于NoteExpress
The first underfill is filled between the first chip and the second chip in order to wrap the first bump.
以及第一底胶，填充在所述第一芯片与所述第二芯片之间，且包覆所述第一凸块；
Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
The die cracking with no-flow underfill is analyzed and compared with the case for conventional capillary-flow underfill.
用断裂力学方法和有限元模拟分析了填充不流动胶芯片断裂问题。
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