博客 ... ultrasonic bonder 超声焊机 ultrasonic bonding 超声焊接 ultrasonic cleaner 超声清洗器 ...
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... Ultrasonic Bonding 超音波结合 ; weak bonding 胶结疏松 ; 胶结不好 ; 文献上称之为弱键 ; 胶结松散 unbreakable bonding 方法二 ; 不能分解的关系 ; 方法二不能分解的关系 ...
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...可键合性；可靠性；超声键合；优化工艺条件 [gap=9392]Keywords: wire bonding; bond ability; reliability; Ultrasonic Bonding; optimum Conditions...
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... ultra-low formaldehyde超低甲醛含量 ultrasonic bonding超声波粘合 ultrasonic fabric sealing system超声波布品密封系统 ...
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ultrasonic bonding machine [机] 超声波焊接机 ; [机] 超声焊接机
high frequency ultrasonic bonding 高频超音波接合
ultrasonic bonding transducer 超声键合换能系统
ultrasonic wire bonding 超音波引线压接 ; 超声引线键合 ; 超音波引线压接机
heat ultrasonic bonding 热超声键合
micro ultrasonic bonding 微超声键合
Nowadays, ultrasonic bonding, which including wire bonding and thermosonic flip chip bonding, are the main packaging processes for manufacturing semiconductor products.
当前,包括单点引线与多点倒装的超声键合构成半导体器件的主要封装形式。
参考来源 - 预紧力对超声换能系统振动特性影响规律研究The frequency spectrums of force response were obtained through output force signals of dynamic force sensor. These experiment phenomena and results are helpful to studied on bonding parameters matching and optimization in ultrasonic bonding.
利用压力传感器输出压力响应信号，得到压力响应曲线的频谱图，实验分析键合压力参数对超声功率参数的匹配，对今后超声键合过程参数的匹配及优化具有一定的指导意义。
参考来源 - TS2100超声键合机换能系统俯仰振动实验研究·2,447,543篇论文数据，部分数据来源于NoteExpress
The characteristics of bonding force in the ultrasonic bonding process were also studied.
在超声引线键合过程中，键合压力是影响键合强度的重要因素之一。
Aluminum wire ultrasonic bonding; transducer drive current; signal time-frequency analysis; feature selecting; quality online monitoring.
粗铝丝超声引线键合；换能器驱动电流；信号时频分析；特征提取；质量在线监测。
According to the circuit of ultrasonic wire bonding experiment platform, a piezoelectric transducer (PZT) driver signal acquisition circuit was designed.
根据超声引线键合实验平台电路结构，设计了PZT(压电陶瓷)驱动信号采集电路。
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