16,薄型小尺寸封装(TSOP)尔必达(Elpida):同步动态存储器(SDRAM)64兆比特512兆比特,x8/x16/x32比特(bit),薄型小尺寸封装(TSOP)森富(Eorex):同步动态存储...
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TSOP II 封装模式 ; 显存封装 ; 颗粒封装 ; 封装模
stacked TSOP 开始应用于内存领域
TSOP BGA 品牌手机
TSOP - 薄型小型塑料
TSOP-I 封装
TSOP P 微型簿片式封装
Shrink TSOP 由于其独到的封装技术
TSOP Thin SOP 薄形SOP
以上来源于: WordNet
All calculations confirm that a compound thickness ratio of 1.2 results in minimal warpage for a large chip TSOP.
所有的计算结果证明化合物厚度比为1.2,会使大芯片TSOP的翘曲问题最小化。
Objective To investigate the diagnosis, treatment and prognosis of lateral and bilateral traumatic superior oblique paralysis (TSOP).
目的通过回顾性研究,对外伤性上斜肌麻痹的诊断、治疗和手术预后进行探讨。
In this thesis, molding process for a typical TSOP product is studied in detail, and FEA (Finite element analysis) has been applied in this process.
本文采用有限元的方法模拟了典型TSOP封装产品的塑封脱模过程。
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