Lithography光刻 Thin Film and Oxidation薄膜及氧化 PECVD在粗化的GaN wafer上沉积SiO2结块问题endura 溅射退火清除表面沾污求助！
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Weak erosion before plating, in a certain: remove metal parts in the solution of surface extremely thin oxidation film, and make the process of surface activation.
弱浸蚀：电镀前，在一定组成溶液中除去金属制件表面极薄的氧化膜，并使表面活化的过程。
It is mainly reason that wet and salt spray environment and thin film of chemical oxidation.
潮湿的盐雾环境和化学氧化膜的薄而软是引起腐蚀的主要原因。
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