Clearance between tube and various dies is of great importance to influence forming limit and quality during thin-walled nc bending process.
管材与不同部位模具间隙是影响薄壁管数控弯曲过程成形极限和成形质量的重要因素。
The fracture of thin/ultra-thin silicon dies accounts for half of the failures of IC cards, and its failure modes and failure mechanism are not well understood then.
薄/超薄芯片的碎裂占据IC卡早期失效的一半以上，其失效模式、失效机理亟待深入研究。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
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