Chemical passivation: will contain antioxidant parts in solution in processing, make the surface to form a thin film of the state of the process. Blunt.
化学钝化：将制件放在含有氧化剂的溶液中处理，使表面形成一层很薄的钝态保护膜的过程。
A new technique for fabricating EMIF in thin film IC based on superfine processing technique is proposed.
提出一种基于集成电路超微细加工技术制造电磁干扰滤波器的薄膜集成制造新技术。
Technics of LTCC MLB processing using thin film circuit technology, ink-jet printing, laser drilling, and conventional manufacturing methods is introduced.
概述了综合运用薄膜线路技术、喷墨打印技术和激光钻孔技术以及采用常规技术制作LTCC基板的简要工艺。
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