昆明贵金属研究所 关键词:金属材料;厚膜浆料;铂;烧结;微观结构 [gap=779]Key words: metal materials; thick film paste; platinum; sintering; microstructure
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thick-film paste 厚膜电子浆料
electronic thick film paste 厚膜电子浆料
thick film dielectric paste 厚膜介质浆料
thick film resistor paste 厚膜电阻浆料
thick film conductor paste 厚膜导体浆料
thick-film conductive paste 厚膜导电浆料
Thick Film Electronic Paste 厚膜电子浆料
thick-film thermistor paste 厚膜热敏电阻浆料
It is well documented that cadmium oxide is an excellent adhesion promoter in thick film gold paste.
镉氧化物在厚膜金浆料中可以起到很好的粘附作用。
Changes of microstructure of the thick film platinum resistance paste during drying and sintering were studied by SEM. The main factors influencing tightness of the sintered membrane were discussed.
通过扫描电镜分析,研究了厚膜铂电阻浆料在烘干、烧结过程中微观结构的变化,讨论了烧结过程中对膜层致密度的影响因素。
The volatility of the organic carrier in thick film resistance paste was studied.
研究了厚膜电阻浆料用有机载体的挥发特性。
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