网络释义专业释义
thermal bonding seam 热黏合接缝
thermal bonding crystal 热键合晶体
thermal bonding technique 热键合技术
Thermal Compression Bonding 热压键合 ; 热压接合
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热键合 - 引用次数：4
Based on thermal visco-elastic theory, the channel deformation during thermal bonding is studied by theory and simulation. The theoretical results are verified by experiments.
基于热粘弹性理论,对热键合中微通道的变形进行了理论分析、有限元仿真和实验研究。
参考来源 - 热塑性聚合物立体结构微流控器件制作方法及相关理论研究封合 - 引用次数：2 参考来源 - 高聚物微流控芯片上金属微器件的研制和应用 -
热键合 - 引用次数：5
A novel plasma assisted thermal bonding method is evaluated to reduce the bonding temperature.
为了降低芯片的热键合温度,本文提出了一种等离子体辅助热键合方法。
参考来源 - 基于等离子体技术的聚合物微纳流控芯片制作
·2,447,543篇论文数据，部分数据来源于NoteExpress
双语例句原声例句
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The process of thermal bonding is simulated by ANSYS.
利用ANSYS软件对热键合过程进行了模拟分析。
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Other than conventional direct thermal bonding, this method has higher efficiency, lower deformation and can realize selective package.
与常用的直接热键合相比，具有效率高、变形小、可实现选择封装等优点。
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In the process of thermal bonding, experiments are carried out under different conditions such as variable polymer thick, temperature, channel width and time.
在对微纳米通道进行热键合过程中，分别改变键合胶层厚度，键合温度，通道尺寸和键合时间四个条件进行了实验。
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Because, when you ask yourself that question, you should consider what is the thermal energy versus the bonding energy?
这是因为，对于这个问题，我们应当考虑到,什么样的热能,对应于键能？
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If the bonding energy is very strongly negative, thermal energy isn't great enough to disrupt those bonds and allow those bonds to be broken and then have fluidity.
如果键能非常强，热能并不足以,打破这些化学键,破坏这些化学键,并使它们液化。
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