The present inventive concept can realize a highly dense memory array with 3d cross-point architecture by simplified processes.
本发明可以通过简化的工艺实现具有3d交叉点结构的高密度存储阵列。
The present invention also provides solutions that include the inventive complexes, kits for preparing these, and methods of using the inventive complexes.
本发明还提供了解决方案，包括发明物，工具包，准备这些，和使用方法的发明物。
Furthermore, the present invention relates to an electrical machining tool as well as a current supply device with the inventive monitoring device and a corresponding method of operation.
本发明还涉及具有这种监控装置的电动工具机及电源装置及相应的运行方法。
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