The preparation method comprises: processing the base material by one of the processing methods such as chemical etching, punching and die cast so as to form the protruding area and the non-protruding area on the surface of the base material; and performing spluttering treatment on the surface of the base material with the protruding area and the non-protruding area at least once so as to make the thicknesses of the film layers on the protruding area and the non-protruding area differ.
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