The invention provides an alignment method, a detecting device for needle position and a probe device, which can simplify multiple probe height detecting procedures with a short time and high precision, and enhance detecting reliability. The alignment method comprises: a procedure of using the detecting device for needle position (16) to detect the needle position for multiple probes (12A) while processing the alignment for semiconductor wafer (W) and the multiple probes (12A); a procedure of using a lower CCD camera (13B) to detect the needle positions of the multiple probes (12A) by the detecting device for needle position (16); a procedure of transferring needle tracks of the multiple probes (12A) to a soft material component (162D) of the detecting device for needle position (16); a procedure of using an upper CCD camera (13A) to detect the needle tracks 162F of the multiple probes; and a procedure of using the upper CCD camera (13A) to detect an electrode mat of the semiconductor wafer (W).

基于1个网页-相关网页