Assembling, testing, repairing and packing of electronic product.
电子产品的组装，测试，维修和包装。
Technical support for local manufacturing covering new supplier evaluation, raw material testing, packing material and label evaluation.
产品本地化生产的技术支持，评估新供应商，原料，包装和标签。
In the close future, we are planning the development of the packing and testing projects of high-end memory, LED display drive chips towards the ultra-thin products trend.
未来计划开发高端存储、LED显示屏驱动芯片封装、测试项目，向超薄型新产品迈进。
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