metal-lographical and TEM analysis 金相分析和电镜分析
tem compositive analysis-dispersion method 透射电镜综合分析分散法
tem-image analysis 透射电镜
tem diffraction analysis 透射电镜衍射分析
analysis using tem 透射电子显微镜分析
The microstructure was investigated by X-ray diffraction and TEM analysis.
采用X射线衍射和透射电子显微镜研究了试样的显微结构。
TEM analysis showed the well-dispersed nanoparticles before and after they were coated with PEG and folic acid.
TEM检测显示，被PEG和叶酸修饰前后的纳米颗粒均具有良好的弥散性。
By tem analysis, the microstructure of the hole expansion strengthened layer of high temperature alloy GH169 was studied.
采用透射电子显微术，研究了GH169高温合金孔挤压强化层的微观结构。
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