...发网文章 全球领先的金属基复合材料设计和制造厂商CPS Technologies Corporation公司,日前针对系统级封装（Systems in Packaging,SiP）芯片开发出了AlSiC金属基盖板。
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This example may seem trivial and unrealistic; however, in complex, real-world systems with many classes, situations like this can happen when classes are missed during packaging or deployment.
这个示例看起来可能价值不大、也不真实，但是，在复杂的有许多类的真实系统中，会因为类在打包或部署期间的遗失而发生这类情况。
These work in conjunction with SCM systems to automatically watch the code repository and build the system (including running tests and packaging artifacts) periodically or whenever anything changes.
它们与SCM系统联合，自动地观察代码存储库，并周期地或在有任何变更的时候构建系统(包括运行测试和打包工件)。
Other packaging systems have their charms, but in this article I'm going to focus on the Debian packaging system.
其它打包系统各有千秋，但在本文中我将集中讨论Debian打包系统。
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