in situ surface activation 原位表面活性化
surface activation methods 表面活化方法
substrate surface activation 基体表面活化法
surface activation treatment 表面活化处理
surface e activation 表面激活
The process is realized by applying surface activation to wafers, selecting suitable laser parameters, and the bonding conditions.
通过对晶圆进行表面活化处理、选择合适的激光参数及键合环境,成功实现了无压力辅助硅/玻璃激光键合。
参考来源 - 晶圆低温键合的理论及实验研究·2,447,543篇论文数据，部分数据来源于NoteExpress
The influencing factors on the surface activation layers during indium seal are also analyzed.
进一步分析了铟封过程中影响阴极表面激活层的因素。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
This paper mainly introduces the study about surface activation of nanometer calcium carbonate by using special activators.
本文主要介绍通过加入特定的表面改性剂，制得了表面改性的活性碳酸钙。
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