Stress balls, stress ball, Personalized stress balls, Squeeze stress balls, Foam stress balls.
压力球,压力球,个性化的压力球,挤压应力球,发泡压力球。
The stress is the direct cause to lead to solder balls failure, which causes microelectronic devices damage.
应力是导致焊球失效的直接原因,进而致使器件失效。
Most of us are walking, talking balls of stress.
我们都在压力下生活着。
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