The reliability of strain silicon, gate dielectric and copper interconnection are discussed, and some new researches are presented.
简介了应变硅材料、栅介质的工艺及铜互连的可靠性，并对新的研究方向做了介绍。
It will also use copper interconnects, low-k, strain silicon and other features. Like 32-nm, Intel will make use of 193-nm immersion lithography.
这款产品将使用Intel第三代HKMG工艺，第五代硅应变技术，另外与32nm类似，22nm制程仍将继续使用193nm液浸式光刻技术。
Strained silicon is a fundamental component of all recent microprocessors. The reason for its success is that local strain-induced deformation in the crystal lattice improves processor performance.
“变形”硅是所有最新的处理器的基本组成部分，原因是：晶格里应变诱发的形变提升了处理器的性能。
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