Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.
此外，利用有限元ansys软件对PC B组件在整个红外再流焊炉中的焊接过程建立了实体模型，进行了PC B组件再流焊全过程的三维动态模拟和仿真。
Suitable for reflow when cheat protection, electronic circuit boards wave soldering tin stove and shelter.
适用于回流焊时对金手指的保护，电子线路板过锡炉和波峰焊锡遮蔽。
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