The topological evolution of coupled pore and grain growth during final stage sintering based on a 2-d continuum diffusion-interface field model is studied.
本文采用二维相场模型模拟固相陶瓷烧结后期，晶粒和气孔耦合生长演化过程。
In the second stage, sintering of primary and secondary particles occurs simultaneously, but the sintering of the compact is controlled by the primary particles.
在烧结的第二阶段，一级与二级颗粒的烧结同时进行，但压块的烧结是被一级颗粒的烧结所控制。
The fundamental formula of capillarity is employed on the Ru-based thick film strain resistors in the progress of sintering, and we got a mathematical model of this stage.
通过应用毛细作用的的基本公式得到钉基厚膜应变电阻烧结阶段的模型。
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