• 层错几率 - 引用次数：7

  The aggregation of Cr, Ni, C atoms and quenched-in vacancies is responsible for the influence of quenching temperature on the stacking fault probability of alloys.

  淬火温度对Fe-Mn-Si基合金层错几率的影响主要是由于铬、镍、碳等原子及淬火空位的偏聚而引起的。

  参考来源 - Fe

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