Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.

阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。

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The finite element analysis (FET) software ANSYS have been used to simulate the temperature and stress distribution in stacked die package under power load.

应用有限元分析软件ANSYS，模拟功率载荷下叠层芯片封装中各层的温度和应力分布。

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Structure: Adopting metal stacked technology. Epoxy resin as dip sealed, plastic case as external package.

采用金属化叠片技术，环氧树脂为灌注材料，外部用塑壳封装。

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Here's how the wine selection in my neighborhood package store stacked up 20 years ago: Most of the shelf space was devoted to jug wines (Riunite, Carlo Rossi, Almaden, etc.).

FORBES: Back to the Future

The new LPDDR3, which marks the first time a 2GB LPDDR3 density is available in one space-saving package, utilizes four LPDDR3 chips stacked together.

ENGADGET: Samsung starts producing faster 2GB LPDDR3 memory for mobile devices, 128GB flash storage too