Disclosed is a sputtering film-forming apparatus which is capable of forming a metal compound film with good characteristics at higher film-forming rate by a simple process at low cost.
提供能够以更快的成膜速度形成具有良好特性的金属化合物膜，并且能够简单地、低成本地构成的溅射成膜装置。
The evaluating method of sputtering cleanout effect on metal target surface by volt-ampere characteristic of target cathode has been given, which provides effective approach to eliminate...
给出了金属靶阴极表面溅射清洗效果的伏安特性评价法，为克服“靶中毒”提供了有效的技术途径。
With the increasing of sputtering time or the increasing of sputtering power or the decreasing of the particle loading amount, both crystallization and grain size of metal film were improved.
溅射时间越长或溅射功率越大或装载量越少，薄膜的平均厚度越厚，薄膜表面越粗糙，金属薄膜的结晶度就越高。
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