The invention relates to a magnetic confinement magnetron sputtering method and a magnetron sputtering device prepared by use of the same.
本发明涉及一种磁约束磁控溅射方法及利用该方法制备的磁控溅射装置。
The utility model belongs to a magnetic control sputtering film coating technology and relates to a magnetic control sputtering device in particular.
本实用新型属磁控溅射镀膜技术，具体涉及一种磁控溅射装置。
The magnetron sputtering device can effectively overcome the problem that the prior art is low in target material utilization rate and deposition rate.
其可以有效克服现有技术存在的靶材利用率低和沉积速率低的 问题。
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