This paper introduces the original struchure and principle of the bondhead device for high speed die bonder designed by author.
本文介绍作者设计的高速芯片焊接机焊头的独特结构和工作原理,并给出了主要设计参数和计算公式。
In designing of the die pattern, a high-speed die-changing structure can be applied to die with the inclination edge to raise the efficiency of blanking.
在模具结构设计方面,斜刃口模具可采用快速换模结构,以提高生产率。
The higher the extrusion speed, the higher the deformation, particularly when plastic comes through the die.
挤出的速度越高,变形就越高,特别是塑料经过模具时。
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