This text simply introduce the technology for Sn-Ce-Ni alloy electroplating. Plating solution is stable. Coat quality is good.
本文简要介绍锡铈镍合金电镀工艺。本工艺镀液稳定，电镀层质量好。
Effects of each component content in solution, process conditions, power source on appearance of Sn deposit were studied by Hull Cell test.
通过赫尔槽试验研究了镀液中各成分含量、操作条件及电源对镀层外观的影响。
Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.
通过这个电镀共沉积的过程，我们有可能用一种单一的方法将金锡合金固体焊料直接镀在晶片上的低共熔点上或其附近。
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