This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.

圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。

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Computer simulation was employed to optimize filling system to predict filling process and prevent the defects for al alloy automotive parts in semi-solid die casting.

在试制铝合金半固态压铸汽车零件过程中，引入计算机模拟技术用于充型过程的预测与缺陷的预防，实现了充型工艺系统的优化设计。

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Because clastic cushions are used in stretching based on multi-point die, the springback in this process is different from that in traditional solid die stretching process.

采用多点模具拉形时，由于弹性垫的使用，拉形后成形件的回弹量与使用整体模拉形时有所不同。

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He notes a World Health Organization estimate that more than one and a half million people a year die from breathing smoke from solid fuels.

VOA: special.2010.02.01

Hit something solid, and you die.

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The top and front covers are made from die-cast magnesium for a solid, yet functional design.

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