This paper study and analysis microelectronic solid film construction and factor that effect the film resistor conductivity and constantity.
本文对微电子固体薄膜结构，以及影响薄膜电阻导电性和稳定性的因素进行了研究和分析。
Designed as a box inside a box, the solid inner wall reduces thermal conductivity while the exterior layer provides additional energy efficiencies.
建筑被设计为一个盒子内嵌一个盒子的形式，内部的实心墙降低了导热系数，而外层提供了额外的节能效果。
The thermal conductivity of thin solid films is different form their bulk material's.
薄膜材料的热导率一般与其相应的块体材料有较大的差异。
应用推荐