1.6 焊接时间(Soldering Time):PCB 焊接面上任一点或指定部位,在波峰焊接过程中接触熔融焊料时间.1.7 压锡深度(Depth Of Impregnated):PCB 被压入锡波的深度.
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Saving labor and soldering time.
可节省人力及后焊之工时。
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Through testing the thermal stability of silica and adhesives, we study how the amount of silica and the cure of adhesives affect the soldering time.
对白炭黑对胶粘剂的热稳定性的影响进行了测试,研究了白炭黑的加入量和胶粘剂的固化条件对耐焊时间的影响。
Its the difference between soldering transistor after transistor into a tangle of wires and printing the whole design, in hundreds of copies at a time, on integrated circuit chips.
FORBES: A hail of silver bullets
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