Residue stress in the ceramic chip of the composite tappet rod may be reduced by intermediate layer of soldered connection and by decreasing thickness of ceramic chip.

钎焊过渡层和减薄陶瓷块厚度可降低钎焊复合挺柱中陶瓷块的残余应力。

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Each P512 module offers 32 megabytes soldered, FPGA-controlled DDR2 SDRAM and an LVDS channel with a connection speed of 230 MHz and 86 megabytes per second.

每个P 512模块提供32兆比特焊接的、现场可编程门阵列控制的DDR2 SDRAM并具有230mhz和每秒86 MB速度的LVDS通道。

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