Process modifications such as solder pot finishes for wave soldering equipment to avoid leaching issues are now available.
为避免出现浸析问题，诸如波焊设备焊锡槽终饰工艺的修改目前已经完成。
Selective pallets shall not be used in conjunction with a no-clean wave solder process.
可选择的板不能用于免洗的波峰焊流程中。
SOLDERABILITY: Wave solder, no wash.
可焊性：波焊，不洗。
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