...条件 Test Conditions 试验数量 Quantity 判断标准 Judging Criteria 可焊性试验 Solderability 焊接温度(Solder Temperature):300℃ 焊接时间(Solder Duration):(3.5±0.5)sec.
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Solder Temperature Control 锡料温控
solder temperature limit 焊料处温度极限
low-temperature solder 特种低温焊料
solder pot temperature 锡炉最高温度
medium-temperature solder 中温钎料
Solder setting temperature 焊锡设定温度
3 solder temperature: 0 ~ 450 degrees, optional settings, intelligent temperature control protection;
焊锡温度:0~450度,随意设置,智能温控保护;
Is the temperature verified on the solder pot before coupons are thermal stressed?
在热应力测试之前是否确认锡炉的温度?
Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly.
焊点疲劳寿命通常是通过电子组件进行温度循环加速试验来确定。
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