It is believed that JetPrinting will more be adopted in electronics assembly, and will also be a competitive solder-paste printing technology.
可以确信焊膏喷印将会被更多地应用于电子组装上，成为一种具有竞争力的焊膏印刷技术。
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.
建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。
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