双语例句
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The solder pad pinch of the device also decreasing rapidly.
焊球尺寸的减小导致了焊球强度也随之降低。
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When the first signal defect is produced, make the signal-exerting solder pad mutually short-circuit.
在产生第一信号缺陷时，使所述信号施加焊盘相互电短接。
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The effects of bending support span, solder pad size, reflow and aging history on PCB bending reliability are discussed.
讨论了弯曲跨距、焊盘尺寸等参数、以及焊点所经历的回流、老化等热过程对PC B焊点弯曲可靠性的影响。
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$firstVoiceSent
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