There is only a small influence of the bond frame width of glass solder on the thermal stress.

玻璃焊料线宽对热应力影响不大，厚度和键合温度越大热应力越大。

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You can either solder them together properly with a metal strip on the front, or just try positioning the metal correctly inside the case with the cells.

你可以使用前面的金属条将他们焊在一起，或者只是定位好电池盒里面的电池单元的金属条。

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In addition, the solder mask coating on printed circuit board, with the plasma treatment, can also obtain certain roughness and high active surface, thus improving the solder coating adhesion.

另外，在阻焊膜涂覆前，用等离子体对印制电路板面处理一下，还可获得一定的粗糙度和高活性的表面，从而提高阻焊膜层的附着力。

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And from a customer standpoint, all they have to do is solder it down on a board.

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