Components required to be mounted off the board are provided with lead forms at the board surface or other mechanical support to prevent lifting of solder land.
需要离开线路板安装的组件在线路板表面利用引脚形状或其它机械支撑来防止焊盘的翘起。
Small solid solder joint, electrical conductivity, and no signal attenuation, when subjected to high temperature and low temperature will not fall off.
焊点细小牢靠、导电性好、无讯号衰减，在经受高温和低温时不会脱落。
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