Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction.

焊料膜制造方法，装备有焊料膜的散热装置，以及半导体器件与散热装置的连接体。

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The selective soldering process offers opportunities to make solder connections on different levels, connecting housing, junction boxes, aluminum parts, stacking PCB's and more.

选择性焊接制程提供相关机会以制造不同层次的焊接，连接元件外壳，接合点，铝部件，多层印刷电路板和其它。

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