The results show that the lesser elasticity module and Coefficient of Thermal Expansion can availably reduce thermal stress, affect the package warpage and the solder joint reliability are the substrate thickness and the die thickness.
计算结果表明，采用较小的弹性模量和热膨胀率的材料可以有效地减小热应力；基板和芯片的厚度是影响封装体热变形和焊点可靠性的主要因素。
参考来源 - 集成电路芯片封装的热—结构数值模拟分析及优化设计·2,447,543篇论文数据，部分数据来源于NoteExpress
Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；
Analyse the failure modes and mechanism of the mixed solder joint, and introduce the effect factors of reliability ulteriorly.
对混合焊点的失效形式和混合焊点的失效机理进行了分析，并进一步介绍了影响这类焊点可靠性的因素。
So the drop impact reliability of solder joint is the key content of unleaded portable electronic products.
因此，焊点跌落可靠性是无铅便携式电子产品可靠性的关键内容。
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